Crushing & Grinding Machines

DISCO Corporation history and figures

By rapidly adapting to market needs and delivering on-demand technologies DISCO Corporation has established itself as a market leader in dicing Kiru grinding Kezuru and polishing Migaku technologi Today DISCO Corporation has over 50 affiliates in 16 countries worldwide The DISCO Headquarter is located in Omori Tokyo...

DISCO Corporation Company Profile

Disco Corporation manufactures and sells precision cutting grinding and polishing machin The Company s precision machines include dicing saws laser saws grinders polishers wafer mounters die separators surface planers and waterjet saws as well as products for dicing before grinding...

Used Disco Corporation Equipment Buy Sell EquipNet

Disco Corporation is a manufacturer typically found in the Semiconductor Industry focusing on precision tooling Headquartered in Tokyo the Japanese manufacturer is most known for making...

MISUZU INDUSTRIES CORPORATION » Equipment

Universal grinding machine TSUGAMI CORPORATION ctg Cylindrical grinding machine TRIPET MUR100 Precision cylindrical grinding machine Equipment Name Manufacturer Model Part No Wafer attach machine Takatori Corporation SAM-8 Dicer DISCO Corporation DFD-6340 UV irradiation machine Takatori Corporation RAD-2000m/6 Inner lead...

Solutions DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently Read this section first How to...

Dicing Before Grinding DBG DISCO Technology Advancing

In DBG first a half-cut is performed on the wafer with a dicing saw Then wafer thinning and die separation are performed at the same time during grinding Because the thinned wafers are never...

Introduction of the Gettering DP wheel

DISCO lineup includes the UltraPoligrind hereafter UPG that achieves high die strength while maintaining the gettering effect It is necessary to modify the Z3-axis grinding specification of...

Introduction of the Gettering DP wheel

DISCO lineup includes the UltraPoligrind hereafter UPG that achieves high die strength while maintaining the gettering effect It is necessary to modify the Z3-axis grinding specification of DGP8760 and DGP8761 fully automatic grinder polishers to realize die...

Dicing and Grinding Using the

Process Workflow 1 Processing by Each Equipment Stand-Alone Each step is performed by stand-alone equipment Protective tape BG tape for backside grinding is laminated onto the wafer...

The Applications of a TAIKO Wafer Grinding

The TAIKO process is a wafer backgrinding method developed by DISCO This process method leaves a ring approximately 3 mm on the wafer outer edge and...

Disco Corporation Production Equipment Japan

Company profile for solar equipment manufacturer Disco Corporation - showing the company s contact details and products manufactured Disco Disco Corporation 13-11 Omori-Kita 2-chome Ota-ku Tokyo 143-8580 81 3 45901111 discocojp Wafer Grinding Equipment...

UltraPoligrind Grinding Wheels Product Information

UltraPoligrind employs an ultra-fine diamond abrasive to create higher die strength and enable grinding with even less damage than Poligrind This new finish grinding wheel is also able to maintain a gettering effect which is often removed when a stress relief process is used...

DISCO machines and supplyer s equipment

DISCO HI-TEC EUROPE Dicing-Grinding Service Liebigstrasse 8 D-85551 Kirchheim b München Germany Phone 49 89 909 03-0 Fax 49 89 909 03-199 dgs discoeurope...

Thinning by Grinding Wheel Grinding DISCO Technology

Overview of Thinning by Grinding Wheel Grinding is a process for making board-shaped workpieces thin approx less than 1 mm thick and flat by using a grinding wheel The grinding wheel is an...

Others Solutions DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently Surface planners use bit grinding...

Solutions for thinning dicing and packaging of power

DISCO CONFIDENTIAL only for customer 164 2013 DISCO CORPORATION All rights reserved SiC Grinding by GS08 and Dry Polishing 4 Roughness much finer than commonly used...

Disco Back Grinding Machines Products Suppliers

Insaco Inc Lens Grinding Polishing Specialized Lens Generating and Polishing Equipment allows Insaco to Manufacture a wide variety of Lens in Sapphire and other Optical Materials Since 1947...

UltraPoligrind Grinding Wheels Product Information

UltraPoligrind employs an ultra-fine diamond abrasive to create higher die strength and enable grinding with even less damage than Poligrind This new finish grinding wheel is also able to maintain a...

DFD6341 Dicing Saws Product Information DISCO

Increased productivity DFD6341 is the latest fully automatic dual spindle dicing saw for Φ8-inch wafers incorporating the throughput enhancement technology developed in DFD6362 for Φ300 mm wafers...

Used Disco Corporation Equipment Buy Sell EquipNet

Disco Corporation is a manufacturer typically found in the Semiconductor Industry focusing on precision tooling Headquartered in Tokyo the Japanese manufacturer is most known for making dicing saws and wafer grinders used for manufacturing semiconductor wafers...

Dicing and Grinding Service Solutions DISCO Corporation

This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE Singapore DISCO HI-TEC EUROPE Munich DISCO HI-TEC CHINA Shanghai DISO HI-TEC TAIWAN Taipei and DISCO...

DISCO CORPORATION DSCSY Company Profile Facts

Description Disco Corporation manufactures and sells precision cutting grinding and polishing machines in Japan and internationally The company s precision machines include dicing saws laser...

DISCO is a manufacturer and distributor of cleaning and

DISCO is a manufacturer and distributor of cleaning and specialty products including fryer filters for foodservice industri Cellucap s acquisition of DISCO significantly extends the product offerings into the foodservice markets From griddle cleaning to expendables filter powders to sponges and scrubbers DISCO covers all of your needs...